www.dialog-semiconductor.com/bluetoothlowenergy

SoC Features

• Complies with Bluetooth 5.0, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47

Part 15 (US) and ARIB STD-T66 (Japan)

• Supports up to 8 Bluetooth LE connections

• Fast cold boot in less than 50 ms

• Processing units

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16 MHz 32 bit ARM Cortex-M0 with SWD interface

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Dedicated Link Layer Processor

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AES-128 bit encryption Processor

• Memories

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64 kB One-Time-Programmable (OTP) memory

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96 kB Data/Retention SRAM

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128 kB ROM Operating System and protocol stack

• Power management

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Integrated Buck/Boost DCDC converter

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P0, P1, P2 and P3 ports with 3.3 V tolerance

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Easy decoupling of only 4 supply pins

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Supports coin (typ. 3.0 V) and alkaline (typ. 1.5 V) battery cells

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1.8 V cold boot support-buck mode

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0.9 V cold boot support-boost mode

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10-bit ADC for battery voltage measurement

• Digital controlled oscillators

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16 MHz crystal (±20 ppm max) and RC oscillator

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32 kHz crystal (±50 ppm)

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RCX oscillator(±500 ppm max)

• Flexible Reset Circuitry

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System & Power On Reset in a single pin

• General purpose, Capture and Sleep timers

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Digital interfaces

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Gen. purpose I/Os: 14 (WL-CSP34), 25 (QFN40), 32 (QFN48)

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2 UARTs with hardware flow control up to 1 MBd

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SPI+™ interface

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I²C bus at 100 kHz, 400 kHz

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3-axes capable Quadrature Decoder

• Analog interfaces

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4-channel 10-bit ADC