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HSDL-3200-021 Datasheet(PDF) 9 Page - Lite-On Technology Corporation

Part # HSDL-3200-021
Description  IrDA짰 Data 1.4 Compliant 115.2 Kb/s Infrared Transceiver
Download  14 Pages
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Manufacturer  LITEON [Lite-On Technology Corporation]
Direct Link  http://www.liteon.com.tw/databook/default.htm
Logo LITEON - Lite-On Technology Corporation

HSDL-3200-021 Datasheet(HTML) 9 Page - Lite-On Technology Corporation

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9
Moisture Proof Packaging
The HSDL-3200 is shipped in
moisture proof packaging. Once
opened, moisture absorption
begins.
Solder Pad, Mask and Metal Stencil
HSDL-3200#021 Recommended Land Pattern (Front Option)
METAL STENCIL
FOR SOLDER PASTE
PRINTING
LAND
PATTERN
PCB
STENCIL
APERTURE
SOLDER
MASK
SHIELD SOLDER PAD
a
b
Y
f
d
e
g
Rx LENS
Tx LENS
theta
FIDUCIAL
X
c
8x PAD
FIDUCIAL
DIMENSION
mm
INCHES
a
b
c (PITCH)
d
e
f
g
1.75
0.60
0.95
1.25
2.70
2.20
2.28
0.069
0.024
0.037
0.049
0.106
0.087
0.089
HSDL-3200-028 Recommended Land Pattern (Top Options)
0.60
0.9
;;
;;
2.20
3.625
MOUNTING CENTER
0.575
1.60
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
PITCH 7 x 0.95
;;;
;;
;;
;;
1.275
1.45
Baking should only be done
once.
In Reels
60
°C, t ≥ 48 hours
100
°C, t ≥ 4 hours
In Bulk
125
°C, T ≥ 2 hours
150
°C, T ≥ 1 hour
Time from Unsealing to
Soldering
After removal from the bag, the
parts should be soldered within
three days if stored at the
recommended storage
conditions.
Baking
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Recommended Storage
Conditions
Storage Temperature
10
°C to 30°C
Relative Humidity
Below 60%


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