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RL0402GK-0797R6L Datasheet(PDF) 7 Page - YAGEO Corporation

Part # RL0402GK-0797R6L
Description  LOW OHMIC CHIP RESISTORS
Download  9 Pages
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Manufacturer  YAGEO [YAGEO Corporation]
Direct Link  http://www.yageo.com
Logo YAGEO - YAGEO Corporation

RL0402GK-0797R6L Datasheet(HTML) 7 Page - YAGEO Corporation

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Chip Resistor Surface Mount
www.yageo.com
May. 27, 2016 V.1
Product specification
7
7
SERIES
RL
0402 to 2512
TESTS AND REQUIREMENTS
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Life/
Endurance
IEC 60115-1 4.25.1
MIL-STD-202 Method 108A
1,000 hours at 70± 2°C applied RCWV
1.5 hours on, 0.5 hour off, still air required
± (2% +0.5mΩ )
High Temperature
Exposure
IEC 60068-2-2
1,000 hours at maximum operating
temperature depending on specification,
unpowered
No direct impingement of forced air to the
parts
Normal power : Tolerances: 155± 5℃
Double power : Tolerances: 125± 5℃
± (1% +0.5mΩ )
Moisture Resistance
MIL-STD-202 Method 106G
Each temperature / humidity cycle is defined at
8 hours, 3 cycles / 24 hours for 10d with 25 °C
/ 65 °C 95% R.H, without steps 7a & 7b,
unpowered
Parts mounted on test-boards, without
condensation on parts
± (2% +0.5mΩ )
Thermal Shock
MIL-STD-202 Method 107G
-55/+125 °C
Number of cycles required is 300.
Devices mounted
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes.
± (1% +0.5mΩ )
Short time overload
IEC60115-1 4.13
RL standard power: 2.5 times rated voltage for
5 sec at room temperature
RL high power: 5 times rated power for 5 sec
at room temperature
± (2% +0.5mΩ )
No visible damage
Board Flex/
Bending
IEC 60115-1 4.33
Device mounted on PCB test board as
described, only 1 board bending required
3 mm bending
Bending time: 60± 5 seconds
Ohmic value checked during bending
± (1% +0.5mΩ )
No visible damage
Table 4 Test condition, procedure and requirements


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