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C412C105J1R5TA7293 Datasheet(PDF) 11 Page - Kemet Corporation |
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C412C105J1R5TA7293 Datasheet(HTML) 11 Page - Kemet Corporation |
11 / 15 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1041_AXIMAX_X7R • 1/10/2017 11 Axial Leaded Multilayer Ceramic Capacitors Aximax, 400 Series, Conformally Coated, X7R Dielectric, 25 – 250 VDC (Commercial Grade) Table 2 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Solderability J-STD-002 Magnification50X.Conditions: a)MethodA,at235°C,Category3 Temperature Cycling JESD22MethodJA-104 5cycles(−55°Cto+125°C),measurementat24hours+/−4hoursaftertestconclusion. BiasedHumidity MIL-STD-202Method103 Loadhumidity,1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor. Measurementat24hours+/−4hoursaftertestconclusion. Lowvolthumidity,1,000hours85C°/85%RHand1.5V.Add100Kohmresistor. Measurementat24hours+/−4hoursaftertestconclusion. Moisture Resistance MIL-STD-202Method106 t=24hours/cycle.Steps7a&7bnotrequired.Unpowered.Measurementat24hours+/−4 hoursaftertestconclusion. ThermalShock MIL-STD-202Method107 −55ºCto+125°C.Note:Numberofcyclesrequired=300.Maximumtransfertime=20 seconds.Dwelltime−15minutes.Air–Air. HighTemperatureLife MIL-STD-202Method108 / EIA -198 1,000hoursat125°C(85°CforZ5U)with1Xratedvoltageapplied. StorageLife MIL-STD-202Method108 125°C,0VDCfor1,000hours. Vibration MIL-STD-202Method204 5gfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB.031"thick7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mountedwithin2"fromanysecurepoint.Testfrom10-2000Hz. Resistance to Soldering Heat MIL-STD-202Method210 ConditionB.Nopreheatofsamples.Note:singlewavesolder–procedure2. TerminalStrength MIL-STD-202Method211 ConditionsA(454g),ConditionC(227g) MechanicalShock MIL-STD-202Method213 Figure1ofMethod213,ConditionC. Resistance to Solvents MIL-STD-202Method215 Addaqueouswashchemical–OKEMCleanorequivalent. Storage & Handling Theun-mountedstoragelifeofaleadedceramiccapacitorisdependentuponstorageandatmosphericconditionsas wellaspackagingmaterials.Whiletheceramicchipsenvelopedundertheepoxycoatingthemselvesarequiterobust inmostenvironments,solderabilityofthewireleadonthefinalepoxy-coatedproductwillbedegradedbyexposureto hightemperatures,highhumidity,corrosiveatmospheres,andlongtermstorage.Inaddition,packagingmaterialswillbe degradedbyhightemperatureandexposuretodirectsunlight–reelsmaysoftenorwarp,andtapepeelforcemayincrease. KEMETrecommendsstoringtheun-mountedcapacitorsintheiroriginalpackaging,inalocationawayfromdirectsunlight, andwherethetemperatureandrelativehumiditydonotexceed40degreescentigradeand70%respectively.Foroptimum solderability,capacitorstockshouldbeusedpromptly,preferablywithin18monthsofreceipt.Forapplicationsrequiring pre-tinningofcomponents,storagelifemaybeextendedifsolderabilityisverified.Beforecleaning,bondingormoldingthese devices,itisimportanttoverifythatyourprocessdoesnotaffectproductqualityandperformance.KEMETrecommends testingandevaluatingtheperformanceofacleaned,bondedormoldedproductpriortoimplementingand/orqualifyingany oftheseprocesses. |
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