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RL1218FK-130R1L Datasheet(PDF) 8 Page - YAGEO Corporation |
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RL1218FK-130R1L Datasheet(HTML) 8 Page - YAGEO Corporation |
8 / 9 page Chip Resistor Surface Mount www.yageo.com May. 27, 2016 V.1 Product specification 8 8 SERIES RL 0402 to 2512 TEST TEST METHOD PROCEDURE REQUIREMENTS Solderability - Wetting J-STD-002 test B Electrical Test not required Magnification 50X SMD conditions: 1st step: method B, aging 4 hours at 155 °C dry heat 2nd step: leadfree solder bath at 245± 3 °C Dipping time: 3± 0.5 seconds Well tinned (≥95% covered) No visible damage - Leaching J-STD-002 test D Leadfree solder, 260 °C, 30 seconds immersion time No visible damage - Resistance to Soldering Heat IEC 60115-1 4.18 Condition B, no pre-heat of samples. Leadfree solder, 260 °C, 10 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ±(1% +0.5mΩ ) No visible damage |
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