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LMS8117ADT-3.3 Datasheet(PDF) 10 Page - National Semiconductor (TI) |
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LMS8117ADT-3.3 Datasheet(HTML) 10 Page - National Semiconductor (TI) |
10 / 16 page Application Note (Continued) TABLE 1. θ JA Different Heatsink Area Layout Copper Area Thermal Resistance Top Side (in 2)* Bottom Side (in 2)( θ JA,˚C/W) SOT-223 ( θ JA,˚C/W) TO-252 1 0.0123 0 136 103 2 0.066 0 123 87 3 0.3 0 84 60 4 0.53 0 75 54 5 0.76 0 69 52 61 0 66 47 7 0 0.2 115 84 8 0 0.4 98 70 9 0 0.6 89 63 10 0 0.8 82 57 11 0 1 79 57 12 0.066 0.066 125 89 13 0.175 0.175 93 72 14 0.284 0.284 83 61 15 0.392 0.392 75 55 16 0.5 0.5 70 53 *Tab of device attached to topside copper www.national.com 10 |
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