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PU5931JKOT30U2L Datasheet(PDF) 8 Page - YAGEO Corporation |
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PU5931JKOT30U2L Datasheet(HTML) 8 Page - YAGEO Corporation |
8 / 9 page - Chip Resistor Surface Mount Product specification 8 9 SERIES PU 3921/ 5931 www.yageo.com Jan. 16, 2017 V.2 TESTS AND REQUIREMENTS TEST TEST METHOD PROCEDURE REQUIREMENTS Short Time Overload IEC60115-1 4.13 5 times of rated power for 5 seconds at room temperature ± (1%+0.0005 Ω) No visible damage High Temperature Exposure AEC-Q200 Test 3 MIL-STD-202 method 108A IEC 60115-1 4.25.3 1,000 hours at maximum operating temperature depending on specification, unpowered, Normal Temperature Range Type:170± 3°C High Temperature Range Type: 275± 5°C ± (1%+0.0005 Ω) Moisture Resistance AEC-Q200 Test 6 MIL-STD-202 method 106F Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts Measurement at 24± 2 hours after test conclusion ± (1%+0.0005 Ω) Biased Humidity AEC-Q200 Test 7 MIL-STD-202 method 103 1,000 hours; 85 °C / 85% RH 10% of operating power Measurement at 24± 4 hours after test conclusion. ± (1%+0.0005 Ω) Life/ Operational Life/ Endurance AEC-Q200 Test 8 MIL-STD-202 method 108A IEC 60115-1 4.25.1 1,000 hours at 70± 5 °C applied RCWV 1.5 hours on, 0.5 hour off, still air required ± (1%+0.0005 Ω) - Resistance to Soldering Heat AEC-Q200 Test 15 MIL-STD-202 method 210F IEC 60115-1 4.18 Condition B, no pre-heat of samples Lead free solder, 260 °C, 10 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ± (0.5%+0.0005 Ω) No visible damage Thermal Shock AEC-Q200 Test 16 MIL-STD-202 method 107 -55/+150 °C Number of cycles is 300. Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air ± (1%+0.0005 Ω) No visible damage Board Flex / Bending AEC-Q200 Test 21 AEC-Q200-005 Chips mounted on a 90mm glass epoxy resin PCB (FR4) Bending: 2 mm Holding time: minimum 60 seconds ± (1%+0.0005 Ω) Table 6 Test condition, procedure and requirements |
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