MBRB3030CTLG, NRVBB3030CTLG

http://onsemi.com

8

PACKAGE DIMENSIONS

SEATING

PLANE

S

G

D

−T−

M

0.13 (0.005)

T

23

1

4

3 PL

K

J

H

V

E

C

A

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.340

0.380

8.64

9.65

B

0.380

0.405

9.65

10.29

C

0.160

0.190

4.06

4.83

D

0.020

0.035

0.51

0.89

E

0.045

0.055

1.14

1.40

G

0.100 BSC

2.54 BSC

H

0.080

0.110

2.03

2.79

J

0.018

0.025

0.46

0.64

K

0.090

0.110

2.29

2.79

S

0.575

0.625

14.60

15.88

V

0.045

0.055

1.14

1.40

−B−

M

B

W

W

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 418B−01 THRU 418B−03 OBSOLETE,

NEW STANDARD 418B−04.

F

0.310

0.350

7.87

8.89

L

0.052

0.072

1.32

1.83

M

0.280

0.320

7.11

8.13

N

0.197 REF

5.00 REF

P

0.079 REF

2.00 REF

R

0.039 REF

0.99 REF

M

L

F

M

L

F

M

L

F

VARIABLE

CONFIGURATION

ZONE

R

N

P

U

VIEW W−W

VIEW W−W

VIEW W−W

12

3

CASE 418B−04

ISSUE K

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

8.38

5.080

DIMENSIONS: MILLIMETERS

PITCH

2X

16.155

1.016

2X

10.49

3.504