Specifications and information are subject to change without notice

WJ Communications, Inc

• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

September 2004

The Communications Edge

TM

AH31

High Dynamic Range IF Amplifier

Product Information

AH31 (SOT-89 Package) Mechanical Information

This package may contain lead-bearing materials. The plating material on the leads is SnPb.

Outline Drawing

Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

°C

Thermal Resistance, Rth

(1)

59

° C / W

Junction Temperature, Tjc

(2)

129

° C

1. The thermal resistance is referenced from the hottest

part of the junction to the ground tab (pin 4).

2. This corresponds to the typical biasing condition of

+5V, 150 mA at an 85

°C case temperature.

A

minimum MTTF of 1 million hours is achieved for

junction temperatures below 160

°C.

Product Marking

The AH31 will be marked with an “AH31”

designator.

An alphanumeric lot code

(“XXXX-X”) is also marked below the part

designator on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 1B

Value:

Passes

500V to <1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes

1000V to <2000V

Test:

Charged Device Model (CDM)

Standard:

JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +235

° C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper

performance of this device. Vias should use a .35mm

(#80 / .0135”) diameter drill and have a final plated

thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer

layers near the part to ensure optimal thermal

performance.

3. Mounting screws can be added near the part to fasten

the board to a heatsink.

Ensure that the ground /

thermal via region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board

in the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material

and construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are

in degrees.

MTTF vs. GND Tab Temperature

1

10

100

1000

60

70

80

90

100

110

Tab Temperature (°C)