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TSOP85540 Datasheet(PDF) 6 Page - Vishay Siliconix |
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TSOP85540 Datasheet(HTML) 6 Page - Vishay Siliconix |
6 / 11 page TSOP853.., TSOP855.. www.vishay.com Vishay Semiconductors Not for New Designs Rev. 1.9, 07-Nov-13 6 Document Number: 81860 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE DIMENSIONS in millimeters ASSEMBLY INSTRUCTIONS Reflow Soldering • Reflow soldering must be done within 72 h while stored under a max. temperature of 30 °C, 60 % RH after opening the dry pack envelope • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Excercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handling after reflow should be done only after the work surface has been cooled off Manual Soldering • Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 °C • Finish soldering within 3 s • Handle products only after the temperature has cooled off (2.2) (4.9) 1.7 nom. 1.7 nom. 8 Not indicated to lerances ± 0.25 Proposed pad layout from component side (dim. for reference only) (0.6) (5x) (R1.35) 1.7 nom 1.7 nom 0.7 (5x) (sideview assembly) (topview assembly) 0.8 (5x) 1.7 12 34 5 4 x 1.7 = 6.8 1.7 4 x 1.7 = 6.8 optional GND pad connection not necessary specifications according to DIN technical drawings Drawing-No.: 6.550-5292.01-4 Issue: 3; 19.11.10 20426 Marking area Pick and Place area possible package deviations caused by tolerances in the manufacturing process either on pick and place side or solder pad side 0 - 0.1 (R1.35) 5:1 |
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