4

TPS61178, TPS611781

SLVSDA7 – FEBRUARY 2017

www.ti.com

Product Folder Links: TPS61178 TPS611781

Submit Documentation Feedback

Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

BST

–0.3

SW + 7

V

–0.3

23

V

–0.3

7

V

Operating junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in

to the device.

(2)

Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows

safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary

precautions.

(3)

Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe

manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary

precautions.

7.2 ESD Ratings

VALUE

UNIT

(1)

Electrostatic discharge

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±750

7.3 Recommended Operating Conditions

Over operating free-air temperature range unless otherwise noted.

MIN

NOM

MAX

UNIT

Input voltage

2.7

20

V

Output voltage

4.5

20

V

Operating junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

TPS61178x

TPS61178x

UNIT

RNW -13 PINs

RNW -13 PINs

Standard

EVM

Junction-to-ambient thermal resistance

55.8

28.5

°C/W

Junction-to-case (top) thermal resistance

24.3

N / A

°C/W

Junction-to-board thermal resistance

14.8

N / A

°C/W

Junction-to-top characterization parameter

0.4

0.6

°C/W

Junction-to-board characterization parameter

14.9

13.8

°C/W

Junction-to-case (bottom) thermal resistance

1.2

N / A

°C/W