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ISOW7840, ISOW7841, ISOW7842, ISOW7843, ISOW7844

SLLSEY2 – MARCH 2017

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7.7 Safety-Related Certifications

All certifications are planned.

VDE

CSA

UL

CQC

TUV

Plan to certify according

to DIN V VDE V 0884-10

(VDE V 0884-10):2006-12

Plan to certify under CSA

Component Acceptance

Notice 5A, IEC 60950-1

and IEC 60601-1

Plan to certify according

to UL 1577 Component

Recognition Program

Plan to certify according

to GB 4943.1-2011

Plan to certify according

to EN 61010-1:2010 (3rd

Ed) and EN 60950-

1:2006/A11:2009/A1:2010

/A 12:2011/A2:2013

Maximum transient

isolation voltage, 7071

Maximum repetitive peak

isolation voltage, 1414

Maximum surge isolation

Reinforced insulation per

CSA 60950-1-07+A1+A2

and IEC 60950-1 2nd Ed.,

working voltage (pollution

degree 2, material group

I);

2 MOPP (Means of

Patient Protection) per

CSA 60601-1:14 and IEC

60601-1 Ed. 3.1, 250

voltage

Single protection, 5000

Reinforced Insulation,

Altitude

≤ 5000 m,

Tropical Climate, 400

voltage;

insulation per EN 61010-

1:2010 (3rd Ed) up to

working voltage of 600

insulation per EN 60950-

1:2006/A11:2009/A1:2010

/A 12:2011/A2:2013 up to

working voltage of 800

Certificate planned

Certificate planned

Certificate planned

Certificate planned

Certificate planned

7.8 Safety Limiting Values

Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of

the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat

the die and damage the isolation barrier potentially leading to secondary system failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Safety input, output, or supply current

400

mA

611

Safety input, output, or total power

see Figure 2

2200

mW

Maximum safety temperature

150

°C

The maximum safety temperature is the maximum junction temperature specified for the device. The power

dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines

the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information is that of a

device installed on a high-K test board for leaded surface-mount packages. The power is the recommended

maximum input voltage times the current. The junction temperature is then the ambient temperature plus the

power times the junction-to-air thermal resistance. For more information see the Thermal Information section.