4

2

3

6

1

8

11

12

7

13

14

10

5

9

Socket base pin A1

BGA pin A1

12.725

17.725

12.725

17.725

4X

1.1913 THRU ALL

0-80 UNF THRU ALL

Insulation plate - Backing plate stack-up

4.59

ITEM NO.

Description

Material

1

GHz Socket Base 10mm IC 3mm Thk

7075-T6 Aluminum Alloy

2

Socket Lid

7075-T6 Aluminum Alloy

3

Compression Plate for 8.9x9.2mm IC

7075-T6 Aluminum Alloy

4

Compression Screw M6x1

Stainless Steel (18-8)

5

#0-80 X .313 LG, SOC HD CAP

SCREW, ALLOY STL, BLK OXIDE

Alloy Steel

6

#0-80 Shoulder Screw, 0.062" thread

length

Stainless Steel (303)

7

Target PCB

FR4

8

Test chip BGA109 11x11 array 0.5mm

pitch 6mm sq DUT

Material <not specified>

9

Dowel Pin, 1/32" x 3/16", SS

Chrome Stainless Steel

10

Ball guide BGA109 11x11 array

0.5mm pitch 6mm sq DUT

Kapton Polyimide/Cirlex

11

IC Guide BGA109 6mm Sq. 1.2mm

thick

Torlon 4203

12

SM elastomer; BGA109 11x11 array

0.5mm pitch 6mm sq DUT

SM elastomer

13

Backing Plate

7075-T6 Alumium Alloy

14

Insulation Plate

FR4 High temp

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: SM-BGA 6mm sq. 0.5mm pitch 11x11 array; 109 pin BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 09/16/2014

Material: Material <not specified>

Finish:

Weight: 7.82

SM-BGA-9054 Drawing

SCALE: 3.5:1

SHEET: 4 OF 5

ENG: S. Faiz

FILE: SM-BGA-9054 Dwg

DRAWN BY: M. Raske