38.621

10.100

15.000

2.450

30.725

66.456

14.3770

2

32.600

47.225

A1 corner

30

58.532

14.100

7.9375

SM-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND

TEST APPLICATIONS

Features

• Wide temperature range (-55C to +150C).

• Current capability is 4A per pin at 14C temperature rise.

• Over 40GHz bandwidth @-1dB for edge pins

• Low and stable contact resistance for reliable production yield.

• Self inductance under 0.21nH.

• Clam shell socket lid

SM interposer

Recommended torque is 30 in-lbs

on heat sink compression screw

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: SM-BGA socket for 23x23mm 34x34 array 0.65mm pitch BGA911 with heat sink

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 8/28/2014

Material: N/A

Finish: N/A

Weight: 150.03

SM-BGA-9052 Drawing

SCALE: 1:1

SHEET: 1 OF 4

ENG: S. Huang

FILE: SM-BGA-9052 Dwg

DRAWN BY: M. Raske