12.225±0.125

SOCKET BASE

0.85±0.05 (x2)

Non plated alignment hole

1.71±0.1 (x4)

Non plated mounting hole

1.250±0.125 (x4)

1.250±0.125 (x4)

2.000

3.000

2.6375

4.450

14.725±0.125

Backing plate size

2.60 (x4)

3.250 (x4)

9.725±0.050 (x4)

3.4875*

0.650 typ.

0.650 typ.

E

Orientation Mark

0.4x0.3 pad (x44)

0.750 (x4)

0.400

0.300

0.500

0.650

0.650

0.650

0.650

0.500

Detail E

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

*Note: QFN pattern is shifted

0.25mm to the right of center with

respect to the mounting holes.

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 9/20/2012

Material: N/A

Finish: N/A

Weight: 7.78

XG-LGA-7004 Drawing

SCALE: 6:1

SHEET: 2 OF 4

DRAWN BY: S. Huang

FILE: XG-LGA-7004 Dwg