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TPS65013 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS65013 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 52 page www.ti.com ABSOLUTE MAXIMUM RATINGS PACKAGE DISSIPATION RATINGS (1) TPS65013 SLVS517 – AUGUST 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. The serial interface can be used for dynamic voltage scaling, for collecting information on and controlling the battery charger status, for optionally controlling 2 LED driver outputs, a vibrator driver, masking interrupts, or for disabling/enabling and setting the LDO output voltages. The interface is compatible with the fast/standard mode I2C™ specification allowing transfers at up to 400 kHz. ORDERING INFORMATION TA PACKAGE PART NUMBER(1) -40 °C to 85°C 7 mm × 7 mm, 48-pin QFN TPS65013RGZ (1) The RGZ package is available in tape and reel. Add R suffix (TPS65013RGZR) to order quantities of 2500 parts per reel. Add T suffix (TPS65013RGZT) to order quantities of 250 parts per reel. over operating free-air temperature range unless otherwise noted(1) UNIT Input voltage on VAC pin with respect to AGND 20 V Input voltage range on all other pins except AGND/PGND pins with respect to AGND -0.3 V to 7 V HBM and CDM capabilities at pins VIB, PG, and LED2 1 kV Current at AC, VBAT, VINMAIN, L1, PGND1 1800 mA Peak current at all other pins 1000 mA Continuous power dissipation See Dissipation Rating Table Operating free-air temperature, TA -40 °C to 85°C Maximum junction temperature, TJ 125 °C Storage temperature, Tstg -65 °C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. AMBIENT MAX POWER DISSIPATION DERATING FACTOR TEMPERATURE FOR Tj= 125°C (2) ABOVE TA= 55°C 25 °C 3 W 30 mW/ °C 55 °C 2.1 W (1) The TPS65013 is housed in a 48-pin QFN package with exposed leadframe on the underside. This 7 mm × 7 mm package exhibits a thermal impedance (junction-to-ambient) of 33 K/W when mounted on a JEDEC high-k board. (2) Consideration needs to be given to the maximum charge current when the assembled application board exhibits a thermal impedance which differs significantly from the JEDEC high-k board. 2 |
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