© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

C1020_X7R_KPS_SMD • 8/11/2016 10

10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, X7R Dielectric, 10 – 250 VDC (Commercial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Board Flex

JIS–C–6429

Appendix 2, Note: 5.0 mm minimum

Solderability

J–STD–002

Magnification 50 X. Conditions:

a) Method B, 4 hours at 155°C, dry heat at 235°C

b) Method B at 215°C category 3

c) Method D, category 3 at 250°C

Temperature Cycling

JESD22 Method JA–104

1,000 cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test conclusion.

Biased Humidity

MIL–STD–202 Method

103

Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.

Measurement at 24 hours +/− 4 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/− 4 hours after test conclusion.

Moisture Resistance

MIL–STD–202 Method

106

t = 24 hours/cycle. Steps 7a and 7b not required.

Measurement at 24 hours +/− 4 hours after test conclusion.

Thermal Shock

MIL–STD–202 Method

107

−55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20

seconds. Dwell time – 15 minutes. Air-Air.

High Temperature Life

MIL–STD–202 Method

108

1,000 hours at 125°C with 1.5X rated voltage applied.

Storage Life

MIL–STD–202 Method

108

150°C, 0 VDC for 1,000 hours.

Vibration

MIL–STD–202 Method

204

5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB .031" thick,

7 secure points on one long side and 2 secure points at corners of opposite sides. Parts

mounted within 2" from any secure point. Test from 10 – 2,000 Hz.

Mechanical Shock

MIL–STD–202 Method

213

Figure 1 of Method 213, Condition F.

Resistance to Solvents

MIL–STD–202 Method

215

Add aqueous wash chemical, OKEM Clean or equivalent.

Storage & Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.