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TSOP754W Datasheet(PDF) 6 Page - Vishay Siliconix |
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TSOP754W Datasheet(HTML) 6 Page - Vishay Siliconix |
6 / 12 page TSOP752..W, TSOP754..W www.vishay.com Vishay Semiconductors Rev. 1.6, 22-Jul-16 6 Document Number: 82496 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE DIMENSIONS in millimeters ASSEMBLY INSTRUCTIONS Reflow Soldering • Reflow soldering must be done within 72 h while stored under a max. temperature of 30 °C, 60 % RH after opening the dry pack envelope • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handling after reflow should be done only after the work surface has been cooled off Manual Soldering • Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 °C • Finish soldering within 3 s • Handle products only after the temperature has cooled off 22609 Drawing-No.: 6.550-5300.01-4 Issue: 4; 13.09.11 6.6 ± 0.1 1.27 3 x 1.27 = 3.81 (4 x) (1) (2.2) 6.8 2.35 0.5 ± 0.1 Pick and place area 0.8 1.27 3 x 1.27 = 3.81 Marking area (0.635) (3.25) Center of sensitive area Mold residue (3 x) Proposed pad layout from component side (for reference only) technical drawings according to DIN specifications Not indicated tolerances ± 0.15 Tool separation line Mold residue |
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