3

5

1

6

7

14

8

9

10

12

13

11

4

2

12.725

4.00

4.00 (X4)

2.50

5.00

5.30

ITEM NO.

DESCRIPTION

Material

QTY.

1

GHz Socket Base 10mm IC 3mm Thk

7075-T6

Aluminum Alloy

1

2

Socket Lid

7075-T6

Aluminum Alloy

1

3

Compression Screw M6x1

Stainless Steel

(18-8)

1

4

Compression Plate 5.75mmx5.8mm IC

7075-T6

Aluminum Alloy

1

5

test chip

Material <not

specified>

1

6

IC guide for 5.8mm x 5.75mm IC

Torlon 4203

1

7

BGA ball guide 16x27 array 0.4mmx0.35mm interstitial pitch

BGA216

Kapton

Polyimide/Cirlex

1

8

SM elastomer for5.75mmx5.8mm 0.4mm pitch 216 ball BGA

Silmat

1

9

test pcb

FR4 High temp

1

10

10x10mm 5 post backing plate

7075-T6

Aluminum Alloy

1

11

#0-80 Shoulder Screw, 0.062" thread length

Stainless Steel

(303)

4

12

Dowel Pin, 1/32" x 3/16", SS

Chrome

Stainless Steel

2

13

#0-80 X .313 LG, SOC HD CAP SCREW, ALLOY STL, BLK

OXIDE

Alloy Steel

4

14

Insulating washer, 4mm OD.

Kapton

Polyimide/Cirlex

5

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: SM socket for 5.75x5.8mm, 16x27 0.4mmx0.35mm interstitial pitch BGA216

Primary dimension units are millimeters, Secondary dimension units are [inches].

STATUS: Released

REV. B

DATE: 5/22/2013

Material: N/A

Finish: N/A

Weight: 6.41

SM-BGA-9030 Drawing

SCALE: 3:1

SHEET: 4 OF 5

DRAWN BY: S. Faiz

FILE: SM-BGA-9030 Dwg