5.70±0.08

6.50±0.08

TOP VIEW

Pin A1 orientation

A

B

B

SEATING PLANE

C

0.25

0.40

6.00

5.20

0.25

0.275±0.050

Ironwood package code: BGA178A

0.555±0.020

0.74±0.03

0.185±0.025

DETAIL B

0.08

0.01 C

C

Dimensions are in millimeters.

1.

Interpret dimensions and tolerances per ASME Y14.5M-1994.

2.

Ball diameter is measured at the maximum solder ball diameter, parallel to datum plane C.

3.

Datum C (seating plane) is defined by the spherical crowns of the solder balls.

4.

Parallelism measurement shall exclude any effect of mark on top surface of package.

5.

Compatible BGA IC

BOTTOM VIEW

FRONT VIEW

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: IC package

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. B

DATE: 12/12/2013

Material: N/A

Finish: N/A

Weight: 6.53

SM-BGA-9043 Drawing

SCALE: 10:1

SHEET: 3 OF 4

ENG: S. Faiz

FILE: SM-BGA-9043 Dwg

DRAWN BY: M. Raske