23.525±0.125 BACKING PLATE

24.225±0.125 SOCKET BASE

4x

1.71±0.10

Non plated mounting hole

2x

0.85±0.025

Non plated alignment hole

21.725

8.3225

10.8625

10.8625

5.7825

1.250±0.125

1.250±0.125

7.6125

4.6875

7.00

12.35

0.50 typ.

0.65 typ.

0.32 pad

A1

*Note: BGA pattern is shifted .25 to the right

with respect to the mounting holes.

Target PCB Recommendations

Total thickness: 1.5mm min.

Plating: Gold or Solder finish

PCB pads height: same or higher than solder mask

Top View

Note:

Full BGA array is shown.

Adjust pattern according

to individual requirements.

SHEET 2 OF 4

SCALE: 3:1

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommmended PCB layout

Primary dimension units are millimeters, Secondary dimension units are [inches].

SG-BGA-7220 Drawing

STATUS: Released

DRAWN BY: E. Smolentseva

File: SG-BGA-7220 Dwg

REV. B

DATE:

FINISH: N/A

MATERIAL: N/A

WEIGHT: 25.58