Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.

Recommended PCB Layout

Top View

BGA IC Size

Pitch

Array

12x16mm

0.65mm

16x22

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

NOTE: Steel backing plate may be required based on end user's application

Status: Released

Drawing: S. Faiz

Scale: NA

Rev: B

Date: 10/3/08

Modified: 7/20/09, AE

File: SG-BGA-7142 Dwg.mcd

SG-BGA-7142 Drawing

© 2009 IRONWOOD ELECTRONICS, INC.

11351 Rupp Drive, Suite 400, Burnsville, MN 55337

Tele: (952) 229-8200

www.ironwoodelectronics.com

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non plated Mounting Hole

non plated Alignment Hole

Orientation Mark

1.25mm±0.13mm (x4)

1.25mm±0.13mm (x4)

21.225mm±0.125mm(x4)

5.08mm

18.725mm (x4)

0.65mm typ.

Ø 1.61mm±0.05mm (x4)

Ø 0.85mm±0.03mm (x2)

4.7375mm

Socket size

2.54mm

Note: BGA pattern is not symmetrical with

respect to the mounting holes. It is offset

by 0.25mm to the right of center.

9.75mm

13.65mm

2.54mm(x4)

Ø 0.40mm x(199)