146 CTI

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Vishay BCcomponents

Revision: 05-Dec-16

4

Document Number: 28403

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print

layout and / or adjacent components.

For recommended soldering pad dimensions, refer to Fig. 3

and Table 3.

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

component during processing.

For maximum conditions refer to Fig. 4.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

As a general principle, temperature and duration shall be the

minimum necessary required to ensure good soldering

connections. However, the specified maximum curves

should never be exceeded.

Fig. 3 - Recommended soldering pad dimensions

Table 3

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters

CASE CODE

a

b

c

d

e

f

0810

4.4

2.5

3.0

-

-

-

1010

4.4

2.5

4.0

-

-

-

1012

4.4

2.5

4.0

-

-

-

1213

6.3

2.5

4.0

4.2

5.0

5.6

1216

6.3

2.5

4.0

4.2

5.0

5.6

1616

7.8

9.6

4.7

-

-

-

1621

7.8

9.6

4.7

-

-

-

1816

8.8

9.6

4.7

-

-

-

1821

8.8

9.6

4.7

-

-

-

aa

c

b

aa

c

b

e

d

f

d

Case size Ø D = 12.5 mm

Case size Ø D

≥ 16 mm

Case size Ø D

≤ 10 mm

a

a

b

c