12.3225

9.7825

14.8625 (X8)

0.80 typ.

24.80

29.725 (x4)

33.475 (x4)

Backing plate outline

32.225±0.125 (x4)

Socket base outline

0.45 Pad

1.70±0.05 (x8) THRU ALL

0.85±0.025 (x2) THRU ALL

2.8375 *

2.4625

1.25±0.125 (x4)

1.25±0.125 (x4)

Pin A1 Orientation

Recommended PCB Layout

Top View

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish.

PCB Pad height: Same or higher

than solder mask.

*Note: BGA pattern is not symmetrical

with respect to the mounting holes.

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: SG BGA socket for 27mm 0.8mm pitch 32x32 array BGA package

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 12-12-2013

Material: N/A

Finish: N/A

Weight: 47.55

SG-BGA-6398 Drawing

SCALE: 3.5:1

SHEET: 2 OF 5

ENG: S. Faiz

FILE: SG-BGA-6398 Dwg

DRAWN BY: M. Raske