4.55

0.2032

0.4572

0.36±0.05

FRONT VIEW

1

2

3

7.00

7.00

1.10

1.10

4.80

2.40

2.40

4.80

0.80

TOP VIEW

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE

WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.

Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

FR4/G10 or equivalent high temp material;

Non-clad

Solder Balls: Sn96.5Ag3.0Cu0.5

Pins: material- Brass Alloy 360 1/2 hard; finish-

0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).

2

1

3

SHEET 1 OF 2

DATE: 3/27/13

MATERIAL:

N/A

FINISH:

N/A

WEIGHT: -

REV. C

File: SF-BGA49B-B-61F Dwg

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

ENG: S. Faiz

STATUS: Released

Description:

Giga-snaP BGA SMT foot: 49 position terminal pins (0.8mm centers, 7x7 array) to SMT solder balls (BGA type).

Pin asignment 1:1.

SCALE:8:1

Primary dimension units are millimeters, Secondary dimension units are [inches].

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate

thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and

specifications are subject to change without notice.

SF-BGA49B-B-61F Drawing

Drawn By: S. Faiz