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LM9810 Datasheet(PDF) 6 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LM9810
Description  LM9810/20 10/12-Bit Image Sensor Processor Analog Front End
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM9810 Datasheet(HTML) 6 Page - National Semiconductor (TI)

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Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional,
but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply
only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2: All voltages are measured with respect to GND=
AGND=DGND=0V, unless otherwise specified.
Note 3: When the input voltage (VIN) at any pin exceeds the power supplies (VIN<GND or VIN>VA or VD), the current at that pin should be limited to 25mA. The 50mA
maximum package input current rating limits the number of pins that can simultaneously safely exceed the power supplies with an input current of 25mA to two.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax, ΘJA and the ambient temperature, TA. The maximum allow-
able power dissipation at any temperature is PD = (TJmax - TA) / ΘJA. TJmax = 150°C for this device. The typical thermal resistance (ΘJA) of this part when board mounted
is 84°C/W for the M20B SOIC package
.
Note 5: Human body model, 100pF capacitor discharged through a 1.5k
Ω resistor.
Note 6: See AN450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in any National Semiconductor Linear
Data Book for other methods of soldering surface mount devices.
AC Electrical Characteristics
The following specifications apply for AGND=DGND=0V, VA=VD=+5.0VDC, fMCLK=24MHz, tMCLK=1/fMCLK, tr=tf=5ns, Rs=25Ω. Boldface
limits apply for T
A=TJ=TMIN to TMAX; all other limits TA=TJ=25°C. (Notes 7 & 8)
Symbol
Parameter
Conditions
Typical
(Note 9)
Limits
(Note 10)
Units
(Limits)
f
MCLK
Maximum MCLK Frequency
24
MHz (min)
MCLK
Duty Cycle
40
60
% (min)
% (max)
tMCLK
MCLK
period
41
ns (min)
tSCNL
SampCLK
falling edge before NewLine
falling edge
3
tMCLK(min)
tSampCLK
SampCLK
period
4
tMCLK(min)
tSampLo
Low time for SampCLK
50
ns (min)
tSampHi
High time for SampCLK
50
ns (min)
tSampSU
SampCLK
falling edge before rising
edge of MCLK
4
ns (min)
tDDO
falling edge of MCLK before new valid
data
40
ns (max)
tHDO
hold time of current data from falling
edge of MCLK
15
ns (min)
tSCLK
D2
(SCLK) Serial Clock Period
1
tMCLK(min)
tDSU
Input data setup time before
D2
(SCLK) rising edge
0
ns (min)
tDH
Input data hold time after D2(SCLK)
rising edge
3
ns (min)
tSCLKLA
D2
(SCLK) rising edge after bit B0
before D1(Latch) rising edge
3
ns (min)
tLASCLK
D1
(Latch) rising edge before next
D2
(SCLK) rising edge
3
ns (min)
tLA
High time for D1(Latch)
3
tMCLK (min)
tLANL
D1
(Latch) rising edge before NewLine
falling edge
3
tSampCLK
(min)


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