21.3625 (x8)

5.08

0.85±0.05 (x2)

Non-plated alignment hole

0.6000 pad (x1521)

1.70±0.10 (x8)

Non-plated mounting hole

1.00 typ.

2.3625

2.7375*

45.225±0.125

Socket base size

42.725±0.050 (x4)

47.725

Insulation Plate

Orientation Mark

*Note: BGA pattern is not symmetrical

with respect to the mounting holes.

Recommended PCB Layout Top View

Note: Full BGA pattern shown. Please adjust pattern

according to individual requirements.

Target PCB Recommendations

Total Thickness: 2.4mm min.

Plating: Gold or Solder finish.

PCB Pad Height: Same or higher than solder mask.

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 2/20/13

Material: N/A

Finish: N/A

Weight: 196.06

SG-BGA-6380 Drawing

SCALE: 2:1

SHEET: 2 OF 5

ENG: S. Huang

FILE: SG-BGA-6380 Dwg

DRAWN BY: S. Huang