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SG-BGA-6300 Datasheet(PDF) 3 Page - Ironwood Electronics. |
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SG-BGA-6300 Datasheet(HTML) 3 Page - Ironwood Electronics. |
3 / 4 page PAGE 3 of 4 Status: Released Drawing: E Smolentseva Scale: - Rev: A Date: 3/3/10 File: SG-BGA-6300 Dwg.mcd SG-BGA-6300 Drawing Modified: © 2010 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com D E Y X Ø0.25 Ø0.10 Z X Y Øb 3 DETAIL TOP VIEW (Reference Only) SIDE VIEW (Reference Only) 3 4 5 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. Compatible BGA Spec 0.20 BOTTOM VIEW (Reference Only) DIM MIN MAX A 2.75 A1 0.3 b 0.7 D E e 21.00 BSC 21.00 BSC 1.0 BSC Array 20x20 e 2 1 A A1 DETAIL 0.15 Z Z 0.25 Z 5 4 |
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