42.50

1.00 typ.

41.00 (x4)

TOP VIEW

2.87

0.51

1.5875

2

1

3

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE

WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.

U.S. Patent No. 8,091,222 B2

SIDE VIEW

TOP ISO VIEW

BOTTOM ISO VIEW

ITEM

NO.

DESCRIPTION

Material

1

SF Pin Substrate BGA1760

FR4 High temp

2

P-S519A, Socket Pin, 1.0mm

centers minimum, #4 clip

Body - Gold Plated Brass 360, Clip - Gold

plated Beryllium Copper 172

3

Solder Ball, 0.024" Dia

Sn63 Pb37

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: SF-BGA1760A 42.5mm 42x42 array 1mm pitch

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 02/19/2014

Material: N/A

Finish: N/A

Weight: 9.89

SF-BGA1760A-B-42 Drawing

SCALE: 2:1

SHEET: 1 OF 1

ENG: S. Huang

FILE: SF-BGA1760A-B-42 Dwg

DRAWN BY: M. Raske