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SG-BGA-6332 Datasheet(PDF) 3 Page - Ironwood Electronics. |
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SG-BGA-6332 Datasheet(HTML) 3 Page - Ironwood Electronics. |
3 / 3 page PAGE 2 of 3 PAGE 3 of 3 Status: Released Drawing: V. Panavala Scale: - Rev: A Date: 10/8/10 File: SG-BGA-6332 Dwg.mcd SG-BGA-6332 Drawing Modified: © 2010 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com D E A A1 Ø b e Ø0.25 Ø0.10 X Y 0.35 Z X Y Z 0.12 Z 3 4 5 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. DIM MIN MAX A 1.70 A1 0.43 b 0.55 D E e 1.0 BSC 0.29 13.0 BSC 13.0 BSC 3 4 5 Compatible BGA Spec. Top View (Reference only) Bottom View (Reference only) Side View (Reference only) Array:12x12 0.45 1.45 |
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