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LM9073 Datasheet(PDF) 15 Page - National Semiconductor (TI) |
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LM9073 Datasheet(HTML) 15 Page - National Semiconductor (TI) |
15 / 18 page Application Information (Continued) In the event that an oscillation is present, input bypassing can also help de-tune the resonance. Figure 7 illustrates two input bypassing approaches. The straight forward addition of a larger valued electrolitic capacitor could suffice. In this case however, if reverse battery connections are possibility it is necessary to add a series protection diode as shown to prevent damaging the polarized input capacitor. An alternative input bypassing scheme is also shown. This eliminates the use of polarized input capacitors and a series protection diode. The values shown were derived empirically in a representative typical application. Appropriate values for any given application require experimentation. Thermal Management The LM9073 is packaged in both a TO-263 surface mount power package and a narrow lead-pitch TO-220 package. To obtain operation over the highest possible load current and input voltage ranges, care must be taken to control the oper- ating temperature of the device. Thermal shutdown protec- tion is built with a threshold above 150˚C Conventional heat sinking techniques can be used with the TO-220 package. When applying the TO-263 package on-board heat sinking is important to prevent thermal shutdown. More copper foil area under the tab of the device will directly reduce the oper- ating junction temperature. Use of a double sided board with vias between two planes of copper as shown in Figure 8 will improve performance ad can optimize the PC board surface area required. Figure 7. Input Bypassing DS101296-22 Figure 8. Typical TO-263 PC Board Heatsinking DS101296-23 www.national.com 15 |
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