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SS-BGA104A-01 Datasheet(PDF) 3 Page - Ironwood Electronics. |
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SS-BGA104A-01 Datasheet(HTML) 3 Page - Ironwood Electronics. |
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3 / 4 page 
A D E Ø b e A1 Z X Y 0.08 Z 0.10 Z 0.20 3 4 5 Dimensions are in millimeters. Interpret dimensions and toleraces per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plame Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. DIM MIN MAX A 1.29 A1 0.17 0.27 b 0.35 D E e 8.00 BSC 8.00 BSC 0.5 BSC 15 x 15 Array 3 4 5 Ø0.15 M Z X M Y M Ø0.05 M Z PAGE 3 of 4 Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Status: Released Drawing: H. Hansen Scale: Rev: B Date: 6/20/05 Modified: 1/3/07 File: SS-BGA104A-01 Dwg SS-BGA104A-01 Drawing © 2006 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com |
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