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SG-BGA-6273 Datasheet(PDF) 3 Page - Ironwood Electronics. |
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SG-BGA-6273 Datasheet(HTML) 3 Page - Ironwood Electronics. |
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3 / 4 page  PAGE 3 OF 4 Status: Released Drawing: E Smolentseva Scale: - Rev: A Date: 10/12/10 File: S G-BGA -6273 Dwg SG-BGA-6273 Drawing Modified: © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Detail A D D1 E E1 X Y 0.10 e Ø b Ø0.25 Z X Y Ø0.30 Z 3 4 5 Dimens ions are in millimeters. Interpret dimensions and t olerances per ASME Y14. 5M-1994. Dimens ion b is measured at the maximum solder ball diameter, parallel to dat um plane Z. Datum Z (s eating plane) is defined by t he spherical crowns of t he solder balls. Parallelism measurement shall exclude any effect of mark on t op surf ac e of pac kage. 2. DIM MIN MAX A 2.50 A1 0.4 0.6 b 0.70 D E e 31.00 BSC 31.00 BSC 1.00 BSC 1. 30 x 30 array D1 7.56 BSC E1 7.56 BSC 3 0.87 Z A1 A 4 0.25 Z 0.15 Z Detail A |
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