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ADS8411IPFBT Datasheet(PDF) 2 Page - Burr-Brown (TI) |
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ADS8411IPFBT Datasheet(HTML) 2 Page - Burr-Brown (TI) |
2 / 23 page www.ti.com ABSOLUTE MAXIMUM RATINGS ADS8411 SLAS369B – APRIL 2002 – REVISED DECEMBER 2004 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) MAXIMUM MAXIMUM NO MISSING PACKAGE TEMPERA- TRANSPORT INTEGRAL DIFFERENTIAL CODES PACKAGE ORDERING MODEL DESIG- TURE MEDIA LINEARITY LINEARITY RESOLUTION TYPE INFORMATION NATOR RANGE QUANTITY (LSB) (LSB) (BIT) Tape and reel ADS8411IPFBT 250 48 Pin ADS8411I –6 ~ 6 –2~3 15 PFB –40 °C to 85°C TQFP Tape and reel ADS8411IPFBR 1000 Tape and reel ADS8411IBPFBT 250 48 Pin ADS8411IB –2.5 ~ 2.5 –1~2 16 PFB –40 °C to 85°C TQFP Tape and reel ADS8411IBPFBR 1000 (1) For the most current specifications and package information, refer to our website at www.ti.com. over operating free-air temperature range unless otherwise noted(1) UNIT +IN to AGND –0.4 V to +VA + 0.1 V Voltage –IN to AGND –0.4 V to 0.5 V +VA to AGND –0.3 V to 7 V Voltage range +VBD to BDGND –0.3 V to 7 V +VA to +VBD –0.3 V to 2.55 V Digital input voltage to BDGND –0.3 V to +VBD + 0.3 V Digital output voltage to BDGND –0.3 V to +VBD + 0.3 V TA Operating free-air temperature range –40 °C to 85°C Tstg Storage temperature range –65 °C to 150°C Junction temperature (TJ max) 150 °C Power dissipation (TJMax - TA)/θJA TQFP package θ JA thermal impedance 86 °C/W Vapor phase (60 sec) 215 °C Lead temperature, soldering Infrared (15 sec) 220 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2 |
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