30.225mm

30.225mm

Assembled

8.25mm +

IC thickness

Recommended torque = 3 in lbs.

A

A

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Insulation Plate: FR4/G10, 1.59mm thick.

Backing Plate: Anodized Aluminum 6.35mm thick.

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8

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All tolerances: ±0.125mm (unless stated

otherwise). Materials and specifications

are subject to change without notice.

Features

Status: Released

Drawing: J. Glab

Scale: -

Rev: C

Date: 12/26/07

File: SG-BGA-6251 Dwg.mcd

SG-BGA-6251 Drawing

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8

6

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High speed, reliable Elastomer connection

Compression plate distributes forces evenly

Ball guide prevents over compression of elastomer

Minimum real estate required

Directly mounts to target PCB (needs tooling holes) with hardware.

Customer's Target PCB

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Top View

Side View

(Section AA)

Easily removable swivel socket lid

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7

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Modified: 07/08/14, DH

PAGE 1 of 4

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Socket Lid: Black anodized Aluminum.

Thickness = 2.5mm.

Socket base screw: Socket head cap, Alloy steel with

black oxide finish, 0-80 fine thread , 15.87mm long.

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Elastomer Guide: Non-clad FR4.

Thickness = 0.725mm.

Compression Plate: Black anodized Aluminum.

Thickness = 2.5mm.

Elastomer: 40 micron dia gold plated brass

filaments arranged symmetrically in a silicone

rubber (63.5 degree angle).

Thickness = 0.75mm.

Socket base: Black anodized Aluminum.

Thickness = 6.5mm.

Ball Guide: Kapton polyimide.

Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine

thread.

Compression screw: Black anodized Aluminum.

Thickness = 5mm, Hex socket = 5mm.

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Customer's

BGA IC

© 2009 IRONWOOD ELECTRONICS, INC.

11351 Rupp Drive, Suite 400, Burnsville, MN 55337

Tele: (952) 229-8200

www.ironwoodelectronics.com

IC Guide: Torlon

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