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TPL5110-Q1

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SNAS681 – FEBRUARY 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

The voltage between any two pins should not exceed 6V.

(4)

board.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage (VDD-GND)

-0.3

6.0

V

-0.3

VDD + 0.3

V

Input Current on any pin

-5

+5

mA

-65

150

°C

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with ANSI/ESDA/JADEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per AEC Q100-011

±750

7.3 Recommended Operating Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply Voltage (VDD-GND)

1.8

5.5

V

Temperature Range

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TPL5110-Q1

UNIT

SOT-23

6 PINS

Junction-to-ambient thermal resistance

163

°C/W

Junction-to-case (top) thermal resistance

26

°C/W

Junction-to-board thermal resistance

57

°C/W

Junction-to-top characterization parameter

7.5

°C/W

Junction-to-board characterization parameter

57

°C/W