© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

T2004_T490 • 9/22/2016

99

Tantalum Surface Mount Capacitors – Standard Tantalum

Soldering Process

KEMET’sfamiliesofsurfacemountcapacitorsarecompatible

with wave (single or dual), convection, IR, or vapor phase

reflowtechniques.Preheatingofthesecomponentsis

recommended to avoid extreme thermal stress. KEMET's

recommendedprofileconditionsforconvectionandIR

reflowreflecttheprofileconditionsoftheIPC/J–STD–020D

standard for moisture sensitivity testing. The devices can

safelywithstandamaximumofthreereflowpassesatthese

conditions.

PleasenotethatalthoughtheX/7343–43casesizecan

withstandwavesoldering,thetallprofile(4.3mmmaximum)

dictates care in wave process development.

Hand soldering should be performed with care due to the

difficultyinprocesscontrol.Ifperformed,careshouldbe

taken to avoid contact of the soldering iron to the molded

case. The iron should be used to heat the solder pad, applying

solderbetweenthepadandthetermination,untilreflow

occurs.Oncereflowoccurs,theironshouldberemoved

immediately. “Wiping” the edges of a chip and heating the top

surface is not recommended.

Duringtypicalreflowoperations,aslightdarkeningofthe

gold-colored epoxy may be observed. This slight darkening is

normal and not harmful to the product. Marking permanency

is not affected by this change.

Profile Feature

SnPb Assembly Pb-Free Assembly

Preheat/Soak

100°C

150°C

150°C

200°C

60 – 120 seconds

60 – 120 seconds

3°C/seconds maximum 3°C/seconds maximum

183°C

217°C

60 – 150 seconds

60 – 150 seconds

220°C*

235°C**

250°C*

260°C**

Time within 5°C of Maximum

20 seconds maximum

30 seconds maximum

Time 25°C to Peak

Temperature

6 minutes maximum

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

*Case Size D, E, P, Y, and X

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

Storage

Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum

storagehumiditynotexceed60%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationon

thepartsandatmospheresshouldbefreeofchlorineandsulphurbearingcompounds.Foroptimizedsolderabilitychipstock

should be used promptly, preferably within three years of receipt.

Time

T

smin

25

T

smax

T

L

T

P

Maximum Ramp Up Rate = 3ºC/sec

Maximum Ramp Down Rate = 6ºC/sec

t

P

t

L

t

s

25ºC to Peak