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SF1806X221ZANDB Datasheet(PDF) 5 Page - API Technologies Corp

Part # SF1806X221ZANDB
Description  Surface Mount EMI Filters
Download  6 Pages
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Manufacturer  APITECH [API Technologies Corp]
Direct Link  http://www.apitech.com/
Logo APITECH - API Technologies Corp

SF1806X221ZANDB Datasheet(HTML) 5 Page - API Technologies Corp

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API TECHNOLOGIES
• 8061 Avonia Rd. • Fairview, PA 16415 • Ph: 814-474-1571 • Fax: 814-474-3110 • eis.apitech.com
API TECHNOLOGIES’ SPECTRUM CONTROL GmbH
• Hansastrasse 6 • 91126 Schwabach, Germany • Phone: (49)-9122-795-0 • Fax: (49)-9122-795-58
Soldering Instructions
General Soldering Notes
1. High soldering temperatures and long soldering
times can cause leaching of the termination and
adversely affect adhesion. These conditions can
also decrease capacitance value. Use the above
recommended solder temperature cycle.
2. Due to the mechanical characteristic of ceramic
composition, aggressive thermal shock will
degrade performance. Preheat the assembly
before soldering using the above solder
temperature profile as a guide.
3. Use mild flux (less than 0.2% by weight of
Chlorine), preferable rosin based. If water soluble,
wash thoroughly to assure all residue is removed
from the underside of components.
4. Ultrasonic Cleaning
When using an ultrasonic cleaning method,
the following range is recommended:
Frequency: Not to exceed 28kHz
Output Power: Not to exceed 20W/liter
Cleaning Time: 5 minutes max
C
A
B
Through hole
.016 to .024
(0.4 to 0.6)
Top view
Bottom view
Connects
to top
Copper
RecommendedBoardPattern
RecommendedBoardPattern
ReflowSoldering
0
60-120
Preheat
Solder
Cool down
50
100
150
200
250
10 max.
120 min.
130 to 150°C
220 to 240°C
Seconds
RecommendedSolderTemperatureProfile
FlowSoldering
FlowSoldering
ReflowSoldering
0
60-120
Preheat
Solder
Cool down
50
100
150
200
250
3-4
120 min.
130 to 150°C
220 to 250°C
Seconds
RecommendedSolderTemperatureProfile
D
A
B
Through hole
.016 to .024
(0.4 to 0.6)
Top view
Bottom view
Connects
to top
E
C
F
Copper
Resist
Surface Mount EMI Filters
Three Terminal Chips
Soldering Specifications
SM6
Board Pattern Dimensions in inches
(mm)
Board Pattern Dimensions in inches
(mm)
Body
Dimension
Style/Size
AB
C
SF0603
0.020
0.047
0.031
(0.5)
(1.2)
(0.8)
SF0805
0.024
0.059
0.039
(0.6)
(1.5)
(1.0)
SF1205
0.051
0.091
0.047
(1.3)
(2.3)
(1.2)
SF1806
0.079
0.138
0.051
(2.0)
(3.5)
(1.3)
Body
Dimension
Style/Size AB C D E F
SF0603 0.020 0.031 0.047 0.031 0.071 0.016
(0.5)
(0.8)
(1.2)
(0.8)
(1.8)
(0.4)
SF0805 0.024 0.031 0.059 0.039 0.087 0.024
(0.6)
(0.8)
(1.5)
(1.0)
(2.2)
(0.6)
SF1205 0.051 0.059 0.091 0.047 0.118 0.024
(1.3)
(1.5)
(2.3)
(1.2)
(3.0)
(0.6)
SF1806 0.059 0.079 0.138 0.051 0.118 0.024
(1.5)
(1.5)
(3.5)
(1.3)
(3.0)
(0.6)


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