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SN74LVC1G18YZAR Datasheet(PDF) 1 Page - Texas Instruments

Part # SN74LVC1G18YZAR
Description  1-OF-2 NONINVERTING DEMULTIPLEXER WITH 3-STATE DESELECTED OUTPUT
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC1G18YZAR Datasheet(HTML) 1 Page - Texas Instruments

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SN74LVC1G18
1-OF-2 NONINVERTING DEMULTIPLEXER
WITH 3-STATE DESELECTED OUTPUT
SCES406G – JULY 2002 – REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D Supports 5-V VCC Operation
D Inputs Accept Voltages to 5.5 V
D Max tpd of 3.4 ns at 3.3 V
D Low Power Consumption, 10-µA Max ICC
D ±24-mA Output Drive at 3.3 V
D Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
D Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
D Ioff Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
D ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
description/ordering information
This noninverting demultiplexer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G18 is a 1-of-2 noninverting demultiplexer with a 3-state output. This device buffers the data
on input A and passes it to either output Y0 or Y1, depending on whether the state of the select (S) input is low
or high, respectively.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
–40 C to 85 C
NanoStar
 – WCSP (DSBGA)
0.17-mm Small Bump – YEA
Reel of 3000
SN74LVC1G18YEAR
_ _ _CJ_
–40 C to 85 C
NanoFree
 – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
Reel of 3000
SN74LVC1G18YZAR
_ _ _CJ_
–40
°C to 85°C
NanoStar
 – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Reel of 3000
SN74LVC1G18YEPR
_ _ _CJ_
NanoFree
 – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC1G18YZPR
SOT (SOT-23) – DBV
Reel of 3000
SN74LVC1G18DBVR
C18_
SOT (SC-70) – DCK
Reel of 3000
SN74LVC1G18DCKR
CJ_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
S
GND
A
Y0
VCC
Y1
3
2
1
4
5
6
A
GND
S
Y1
VCC
Y0
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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