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AD5671R Datasheet(PDF) 30 Page - Analog Devices

Part No. AD5671R
Description  Base station power amplifiers
Download  32 Pages
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Maker  AD [Analog Devices]
Homepage  http://www.analog.com
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AD5671R Datasheet(HTML) 30 Page - Analog Devices

 
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AD5671R/AD5675R
Data Sheet
Rev. B | Page 30 of 32
APPLICATIONS INFORMATION
POWER SUPPLY RECOMMENDATIONS
The AD5671R/AD5675R is typically powered by the following
supplies: VDD = 3.3 V and VLOGIC = 1.8 V.
The ADP7118 can be used to power the VDD pin. The ADP160
can be used to power the VLOGIC pin. This setup is shown in
Figure 67. The ADP7118 can operate from input voltages up to
20 V. The ADP160 can operate from input voltages up to 5.5 V.
Figure 67. Low Noise Power Solution for the AD5671R/AD5675R
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the AD5671R/AD5675R is done
via a serial bus that uses a standard protocol that is compatible
with DSP processors and microcontrollers. The communications
channel requires a 2-wire interface consisting of a clock signal
and a data signal.
AD5671R/AD5675R TO ADSP-BF531 INTERFACE
The I2C interface of the AD5671R/AD5675R is designed for
easy connection to industry-standard DSPs and microcontrollers.
Figure 68 shows the AD5671R/AD5675R connected to the Analog
Devices, Inc., Blackfin® processor. The Blackfin processor has
an integrated I2C port that can be connected directly to the I2C
pins of the AD5671R/AD5675R.
Figure 68. AD5671R/AD5675R to ADSP-BF531 Interface
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. Design the printed circuit board (PCB) on
which the AD5671R/AD5675R are mounted so that the devices
lie on the analog plane.
The AD5671R/AD5675R must have ample supply bypassing of
10 µF in parallel with 0.1 µF on each supply, located as close to
the package as possible, ideally right up against the device. The
10 µF capacitors are tantalum bead type. The 0.1 µF capacitor
must have low effective series resistance (ESR) and low effective
series inductance (ESI), such as the common ceramic types,
which provide a low impedance path to ground at high
frequencies to handle transient currents due to internal logic
switching.
In systems where there are many devices on one board, it is
often useful to provide some heat sinking capability to allow
the power to dissipate easily.
The GND plane on the device can be increased (as shown in
Figure 69) to provide a natural heat sinking effect.
Figure 69. Pad Connection to Board
GALVANICALLY ISOLATED INTERFACE
In many process control applications, it is necessary to provide
an isolation barrier between the controller and the unit being
controlled to protect and isolate the controlling circuitry from
any hazardous common-mode voltages that may occur. iCoupler®
products from Analog Devices provide voltage isolation in excess
of 2.5 kV. The serial loading structure of the AD5671R/AD5675R
makes the devices ideal for isolated interfaces because the number
of interface lines is kept to a minimum. Figure 70 shows a
2-channel isolated interface to the AD5671R/AD5675R
using an ADuM1251. For further information, visit
www.analog.com/icoupler.
Figure 70. Isolated Interface
ADP160
LDO
ADP7118
LDO
5V
INPUT
1.8V: VLOGIC
3.3V: VDD
ADSP-BF531
SCL
GPIO1
LDAC
PF9
RESET
PF8
SDA
GPIO2
AD5671R/
AD5675R
AD5671R/
AD5675R
GND
PLANE
BOARD
DECODE
SDA
CONTROLLER
ADuM12511
SCL
1ADDITIONAL PINS OMITTED FOR CLARITY.
ENCODE
TO
SCL
TO
SDA
ENCODE
DECODE
ENCODE
DECODE


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