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AD5671R Datasheet(PDF) 9 Page - Analog Devices

Part No. AD5671R
Description  Base station power amplifiers
Download  32 Pages
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Maker  AD [Analog Devices]
Homepage  http://www.analog.com
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AD5671R Datasheet(HTML) 9 Page - Analog Devices

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Data Sheet
AD5671R/AD5675R
Rev. B | Page 9 of 32
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter
Rating
VDD to GND
−0.3 V to +7 V
VLOGIC to GND
−0.3 V to +7 V
VOUTx to GND
−0.3 V to VDD + 0.3 V
VREFOUT to GND
−0.3 V to VDD + 0.3 V
Digital Input Voltage to GND
−0.3 V to VLOGIC + 0.3 V
Operating Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
125°C
Reflow Soldering Peak Temperature,
Pb Free (J-STD-020)
260°C
ESD
Human Body Model (HBM)
2 kV
Field Induced Charged Device Model
(FICDM)
1.5 kV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
The design of the thermal board requires close attention. Thermal
resistance is highly impacted by the printed circuit board (PCB)
being used, layout, and environmental conditions.
Table 7.Thermal Resistance
Package Type
θJA
θJB
θJC
ΨJT
ΨJB
Unit
20-Lead TSSOP
(RU-20)1
98.65
44.39
17.58
1.77
43.9
°C/W
20-Lead LFCSP
(CP-20-8)2
82
16.67
32.5
0.43
22
°C/W
1
Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board. See JEDEC JESD51
2
Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board with nine thermal vias. See JEDEC JESD51.
ESD CAUTION


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