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SG-BGA-6162 Datasheet(PDF) 3 Page - Ironwood Electronics. |
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SG-BGA-6162 Datasheet(HTML) 3 Page - Ironwood Electronics. |
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3 / 4 page  PAGE 3 of 4 Status: Released Drawing: H. Hansen Scale: - Date: 11/2/05 File: SG-BGA-6162 Dwg SG-BGA-6162 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Rev: B Modified: 6/15/09, AE D E Øb 3 TOP VIEW SIDE VIEW Compatible BGA Spec BOTTOM VIEW e DETAIL DIM MIN MAX A 2.5 A1 0.4 0.6 b 0.7 D E e 35.0 BSC 35.0 BSC 1.00 BSC Array 34x34 0.5 (4x)1mm 3 4 5 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. A A1 DETAIL 0.2 Z Z 0.20 Z 5 4 0.1mm Min X Y 0.20 Ø0.25 Ø0.10 Z X Y Z |
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