Document Number: 002-03341 Rev.*C

Page 10 of 38

S6BP401A

6. Absolute Maximum Ratings

Table 6-1 Absolute Maximum Ratings

Parameter

Symbol

Condition

Rating

Unit

Min

Max

Power supply voltage

VCC

-0.3

+6.9

V

PVCC1, PVCC2, PVCC3, PVCC4

-0.3

+6.9

V

PVCCL1, PVCCL2

-0.3

+6.9

V

Input voltage

EN1, EN2, EN3, EN4, ENL1, ENL2

-0.3

+6.9

V

WDI

-0.3

+6.9

V

SYNC

-0.3

+6.9

V

FB1, FB2, FB3, FB4

-0.3

+6.9

V

PG1, PG2, PG3, PG4, PGL2

-0.3

+6.9

V

RST

-0.3

+6.9

V

LX voltage

LX1, LX2, LX3, LX4

-0.3

+6.9

V

Voltage difference

PVCC1 -VCC, PVCC2-VCC,

PVCC3-VCC, PVCC4-VCC

-0.3

+0.3

V

PGND1-GND, PGND2-GND,

PGND3-GND, PGND4-GND

-0.3

+0.3

V

PVCC1-LX1, PVCC2-LX2,

PVCC3-LX3, PVCC4-LX4

-0.3

+6.9

V

VCC-EN1, VCC-EN2, VCC-EN3,

VCC-EN4, VCC-EN1L, VCC-EN2L,

VCC-WDI, VCC-SYNC, VCC-FB1,

VCC-FB2, VCC-FB3, VCC-FB4

-0.3

+6.9

V

Power dissipation

-

6940

mW

Junction temperature

-

-40

+150

°C

Storage temperature

-

-55

+150

°C

*1: When the IC is mounted on 76.2 mm × 114.3 mm four-layer epoxy board. IC is mounted on a four-layer epoxy board, which

terminal bias, and the IC’s thermal pad is connected to the epoxy board.

WARNING

1.

Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current or

temperature) in excess of absolute maximum ratings. Do not exceed any of these ratings.

Figure 6-1 Maximum Power Dissipation - Operating Ambient Temperature Characteristics

0

1000

2000

3000

4000

5000

6000

7000

8000

-60 -40 -20

0

20

40

60

80 100 120 140

Ambient Temperature T