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CY7C1069GN30-10ZSXIT Datasheet(PDF) 5 Page - Cypress Semiconductor |
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CY7C1069GN30-10ZSXIT Datasheet(HTML) 5 Page - Cypress Semiconductor |
5 / 15 page CY7C1069GN Document Number: 002-00046 Rev. *A Page 5 of 15 Capacitance Parameter [4] Description Test Conditions TSOP II VFBGA Unit CIN Input capacitance TA = 25 °C, f = 1 MHz, VCC = 3.3 V 10 10 pF COUT IO capacitance 10 10 pF Thermal Resistance Parameter [4] Description Test Conditions TSOP II VFBGA Unit ΘJA Thermal resistance (junction to ambient) Still air, soldered on a 3 × 4.5 inch, four layer printed circuit board 93.63 31.50 °C/W ΘJC Thermal resistance (junction to case) 21.58 15.75 °C/W AC Test Loads and Waveforms Figure 3. AC Test Loads and Waveforms [5] 90% 10% 3.0 V GND 90% 10% ALL INPUT PULSES 3.3 V OUTPUT 5 pF* INCLUDING JIG AND SCOPE (b) R1 317 Ω R2 351 Ω Rise Time > 1 V/ns Fall Time: > 1 V/ns (c) OUTPUT 50 Ω Z0 = 50 Ω VTH = 1.5 V 30 pF* * Capacitive load consists of all components of the test environment High Z characteristics (a) Notes 4. Tested initially and after any design or process changes that may affect these parameters. 5. Full device AC operation assumes a 100-μs ramp time from 0 to VCC(min) and 100-μs wait time after VCC stabilization. |
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