CY7C1069GN

Document Number: 002-00046 Rev. *A

Page 5 of 15

Capacitance

Parameter [4]

Description

Test Conditions

TSOP II

VFBGA

Unit

Input capacitance

10

10

pF

IO capacitance

10

10

pF

Thermal Resistance

Parameter [4]

Description

Test Conditions

TSOP II

VFBGA

Unit

Thermal resistance

(junction to ambient)

Still air, soldered on a 3 × 4.5 inch, four

layer printed circuit board

93.63

31.50

°C/W

Thermal resistance

(junction to case)

21.58

15.75

°C/W

AC Test Loads and Waveforms

Figure 3. AC Test Loads and Waveforms [5]

90%

10%

3.0 V

GND

90%

10%

ALL INPUT PULSES

3.3 V

OUTPUT

5 pF*

INCLUDING

JIG AND

SCOPE

(b)

R1 317

Ω

R2

351

Ω

Rise Time > 1 V/ns

Fall Time:

> 1 V/ns

(c)

OUTPUT

50

Ω

30 pF*

*

Capacitive load consists

of all components of the

test environment

High Z characteristics

(a)

Notes

4. Tested initially and after any design or process changes that may affect these parameters.