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CYBLE-212006-01 Datasheet(PDF) 6 Page - Cypress Semiconductor

Part # CYBLE-212006-01
Description  Module size: 15.00 mm 횞 23.00 mm 횞 2.00 mm
Download  39 Pages
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CYBLE-212006-01 Datasheet(HTML) 6 Page - Cypress Semiconductor

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Document Number: 002-15631 Rev.*B
Page 6 of 39
PRELIMINARY
CYBLE-212006-01
CYBLE-202007-01
CYBLE-202013-11
Pad Connection Interface
As shown in the bottom view of Figure 1 on page 5, the CYBLE-2X20XX-X1 connects to the host board via solder pads on the backside
of the module. Table 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-2X20XX-X1 module.
Figure 2. Solder Pad Dimensions (Seen from Bottom)
To maximize RF performance, the host layout should follow these recommendations:
1. The ideal placement of the Cypress BLE module is in a corner of the host board with the trace antenna located at the far corner.
This placement minimizes the additional recommended keep out area stated in item 2. Please refer to AN96841 for module
placement best practices.
2. To maximize RF performance, the area immediately around the Cypress BLE module trace antenna should contain an additional
keep out area, where no grounding or signal trace are contained. The keep out area applies to all layers of the host board. The
recommended dimensions of the host PCB keep out area are shown in Figure 3 (dimensions are in mm).
Figure 3. Recommended Host PCB Keep Out Area Around the CYBLE-2X20XX-X1 Antenna
Table 2. Solder Pad Connection Description
Name
Connections Connection Type
Pad Length Dimension
Pad Width Dimension
Pad Pitch
SP
30
Solder Pads
1.02 mm
0.71 mm
1.27 mm
Host PCB Keep Out Area Around Trace Antenna


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