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CYBLE-212006-01 Datasheet(PDF) 4 Page - Cypress Semiconductor

Part # CYBLE-212006-01
Description  Module size: 15.00 mm 횞 23.00 mm 횞 2.00 mm
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CYBLE-212006-01 Datasheet(HTML) 4 Page - Cypress Semiconductor

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Document Number: 002-15631 Rev.*B
Page 4 of 39
PRELIMINARY
CYBLE-212006-01
CYBLE-202007-01
CYBLE-202013-11
Overview
Module Description
The CYBLE-2X20XX-X1 module is a complete module designed to be soldered to the applications main board.
Module Dimensions and Drawing
Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE
module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained. Designs
should be held within the physical dimensions shown in the mechanical drawings in Figure 1 on page 5. All dimensions are in
millimeters (mm).
Table 1. Module Design Dimensions
See Figure 1 on page 5 for the mechanical reference drawing for CYBLE-2X20XX-X1.
Dimension Item
Specification
Module dimensions
Length (X)
15.00 ± 0.15 mm
Width (Y)
23.00 ± 0.15 mm
Antenna location dimensions
Length (X)
15.00 ± 0.15 mm
Width (Y)
4.65 ± 0.15 mm
PCB thickness
Height (H)
0.80 ± 0.10 mm
Shield height
Height (H)
1.20 ± 0.10 mm
Maximum component height
Height (H)
1.20 mm typical (shield) - CYBLE-212006-01
1.25 mm typical (connector) - CYBLE-202007-01
0.75mm typical (crystal) - CYBLE-202013-11
Total module thickness (bottom of module to highest component)
Height (H)
2.00 mm typical - CYBLE-212006-01
2.05 mm typical - CYBLE-202007-01
1.55 mm typical - CYBLE-202013-11


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