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SG-BGA-6071 Datasheet(PDF) 3 Page - Ironwood Electronics. |
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SG-BGA-6071 Datasheet(HTML) 3 Page - Ironwood Electronics. |
3 / 3 page PAGE 3 of 3 Status: Released Drawing: H. Hansen Scale: - Rev: A Date: 11/12/02 File: SG-BGA-6071 Dwg.mcd SG-BGA-6071 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Modified: D E Y X TOP VIEW Compatible BGA Spec BOTTOM VIEW e A Z 3 4 5 Dimensions are in millimeters. Interpret dimensions and toleraces per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plame Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. DIM MIN MAX A 3.298 A1 0.9 b 0.8 D E e 1.0 BSC 0.8 27.0 BSC 27.0 BSC 0.7 4 Side View 5 0.15 Z A1 2.978 Ø b Ø0.10 X Y Ø0.25 3 Array: 26 x 26 0.20 Z SIDE VIEW (heat sink lid should be milled to accomodate die and caps on top surface of package) |
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