SG-BGA-6071 datasheet(3/3 Pages) IRONWOOD

Part #	SG-BGA-6071

Description	Directly mounts to target PCB (needs tooling holes) with included hardware

Download	3 Pages

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Manufacturer	IRONWOOD [Ironwood Electronics.]

Direct Link	http://www.ironwoodelectronics.com

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3 / 3 page

PAGE 3 of 3

Status: Released

Drawing: H. Hansen

Scale: -

Rev: A

Date: 11/12/02

File: SG-BGA-6071 Dwg.mcd

SG-BGA-6071 Drawing

PO BOX 21151 ST. PAUL, MN 55121

Tele: (651) 452-8100

www.ironwoodelectronics.com

Modified:

D

E

Y

X

TOP VIEW

Compatible BGA Spec

BOTTOM VIEW

e

A

Z

3

4

5

Dimensions are in millimeters.

Interpret dimensions and toleraces per

ASME Y14.5M-1994.

Dimension b is measured at the

maximum solder ball diameter, parallel

to datum plame Z.

Datum Z (seating plane) is defined

by the spherical crowns of the solder balls.

Parallelism measurement shall exclude

any effect of mark on top surface of

package.

1.

2.

DIM

MIN

MAX

A

3.298

A1

0.9

b

0.8

D

E

e

1.0 BSC

0.8

27.0 BSC

0.7

4

Side View

5

0.15 Z

A1

2.978

Ø b

Ø0.10

X Y

Ø0.25

3

Array: 26 x 26

0.20 Z

SIDE VIEW

(heat sink lid should be milled to accomodate

die and caps on top surface of package)

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