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C0603C106J5NALTU Datasheet(PDF) 4 Page - Kemet Corporation |
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C0603C106J5NALTU Datasheet(HTML) 4 Page - Kemet Corporation |
4 / 23 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1008_X8L_150C_SMD • 2/29/2016 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade) Dimensions – Standard Termination – Millimeters (Inches) L B W S T EIA Size Code Metric Size Code L Length W Width T Thickness B Bandwidth S Separation Minimum Mounting Technique 0402 1005 1.00 (0.040) ±0.05 (0.002) 0.50 (0.020) ±0.05 (0.002) See Table 2 for Thickness 0.30 (0.012) ±0.10 (0.004) 0.30 (0.012) Solder Reflow Only 0603 1608 1.60 (0.063) ±0.15 (0.006) 0.80 (0.032) ±0.15 (0.006) 0.35 (0.014) ±0.15 (0.006) 0.70 (0.028) Solder Wave or Solder Reflow 0805 2012 2.00 (0.079) ±0.20 (0.008) 1.25 (0.049) ±0.20 (0.008) 0.50 (0.02) ±0.25 (0.010) 0.75 (0.030) 1206 3216 3.20 (0.126) ±0.20 (0.008) 1.60 (0.063) ±0.20 (0.008) 0.50 (0.02) ±0.25 (0.010) N/A 1210 3225 3.20 (0.126) ±0.20 (0.008) 2.50 (0.098) ±0.20 (0.008) 0.50 (0.02) ±0.25 (0.010) Solder Reflow Only Dimensions – Flexible Termination – Millimeters (Inches) EIA Size Code Metric Size Code L Length W Width T Thickness B Bandwidth S Separation Minimum Mounting Technique 0603 1608 1.60 (0.063) ±0.17 (0.007) 0.80 (0.032) ±0.15 (0.006) See Table 2 for Thickness 0.45 (0.018) ±0.15 (0.006) 0.58 (0.023) Solder Wave or Solder Reflow 0805 2012 2.00 (0.079) ±0.30 (0.012) 1.25 (0.049) ±0.30 (0.012) 0.50 (0.020) ±0.25 (0.010) 0.75 (0.030) 1206 3216 3.30 (0.130) ±0.40 (0.016) 1.60 (0.063) ±0.35 (0.013) 0.60 (0.024) ±0.25 (0.010) N/A 1210 3225 3.30 (0.130) ±0.40 (0.016) 2.60 (0.102) ±0.30(0.012) 0.60 (0.024) ±0.25 (0.010) Solder Reflow Only Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. |
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