© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1007_X8R_ULTRA_150C_SMD • 3/3/2016 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Temperature 150°C Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Board Flex

JIS–C–6429

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.

Flexible termination system – 3.0 mm (minimum).

Solderability

J–STD–002

Magnification 50 X. Conditions:

a) Method B, 4 hours @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

c) Method D, category 3 @ 260°C

Temperature Cycling

JESD22 Method JA–104

1,000 cycles (−55°C to +150°C). Measurement at 24 hours +/- 4 hours after test conclusion.

Biased Humidity

MIL–STD–202 Method 103

Load Humidity: 1,000 hours 85°C/85%RH and rated voltage. Add 100K ohm resistor. Measurement

at 24 hours +/- 4 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at

24 hours +/- 4 hours after test conclusion.

Moisture Resistance

MIL–STD–202 Method 106 t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours. +/- 4 hours after test

conclusion.

Thermal Shock

MIL–STD–202 Method 107 −55°C/+150. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell

time – 15 minutes. Air – Air.

High Temperature Life

MIL–STD–202 Method 108

/EIA–198

1,000 hours at 150°C with 2 X rated voltage applied.

Storage Life

MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.

Vibration

MIL–STD–202 Method 204

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure

points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"

from any secure point. Test from 10 – 2,000 Hz

Mechanical Shock

MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.