Status: Released

Drawing: E Smolentseva

Scale: 3:1

Rev: G

Date: 9/6/01

File: SG-BGA-6018 Dwg.mcd

SG-BGA-6018 Drawing

© 2009 IRONWOOD ELECTRONICS, INC.

Tele: (952) 229-8200

www.ironwoodelectronics.com

Modified: 6/26/09, AE

PAGE 2 of 3

Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.

Recommended PCB Layout

Top View

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

NOTE: Steel backing plate may be required based on end user's application

*Note: BGA pattern is not symmetrical

with respect to the mounting holes.

Note: Full BGA pattern shown.

Please adjust pattern according

to individual requirements.

Socket

Body Size

Mounting Hole

Alignment Hole

Orientation Mark

Ø 1.61mm±0.05mm (x4)

Ø 0.85mm±0.025mm (x2)

Ø 0.36mmPAD

12.225mm±0.125mm (x4)

9.725mm (x4)

2.84mm*

2.46mm

1.25mm±0.125mm (x4)

1.25mm±0.125mm (x4)

0.8mm typ.

2mm

3mm

4.95mm